Hardware Engineer Interview Questions

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1. What ways can you increase the damping in a camera actuator mechanism? 2. Draw voltage divider bias circuit and derive the output voltage. 3. Give some examples of MEMS devices that fail by ESD/EOS failure mechanism. 4. Why can't an airplane fly into outer space? 5. Cantilever beam-what point of application of force will cause the earliest failure? 6. How would you model a torque force in a FEA model?
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Haptic Hardware Engineer

Interviewed at Apple

4.1
Feb 5, 2016

1. What ways can you increase the damping in a camera actuator mechanism? 2. Draw voltage divider bias circuit and derive the output voltage. 3. Give some examples of MEMS devices that fail by ESD/EOS failure mechanism. 4. Why can't an airplane fly into outer space? 5. Cantilever beam-what point of application of force will cause the earliest failure? 6. How would you model a torque force in a FEA model?

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