Process was long, including phone screen, take home design challenge for 1 week, 1 entire day panel interviews and review of design challenge. Entire process took at least a month.
I applied through an employee referral. I interviewed at Apple (Cupertino, CA) in Dec 2025
Interview
The interview process was pretty structured. HR was very supportive and helpful. She reached out over LinkedIn for Apple Interconnect Team.
Study about basics baleam bending areas, magnets and thermal Design.
Interview questions [1]
Question 1
Gave me a cross section of a female connector which had a spring like a cantilever beam coming out.
She asked the current force generated by the spring is less than required force, so as a PDE how will you solve the issue?
Multistage interview process. Begins with a phone interview, then a design challenge, an interview day with multiple team members, and then a presentation. It is a long and tedious process, often scheduled out weeks in advance.
Interview questions [1]
Question 1
Basic Beam Bending questions, material selection, how different variables can be manipulated