General Overview

Functional Area: Engineering
Career Stream: Design Engineering Mechanical
SAP Short Name: LEN-ENG-DME
Job Level: Level 08
IC/MGR: Individual Contributor
Direct/Indirect Indicator: Indirect

Summary

We are looking for a Senior Engineer with leadership capabilities to manage the mechanical development of complex ruggedized electronic systems (Control Units, Power, and Computing modules). The ideal candidate will lead the engineering team in Spain, acting as the focal point for design decisions, and will coordinate technical integration with our international engineering teams.

Detailed Description

1. Team Leadership & Project Management:

• Team Management: Lead, mentor, and prioritize tasks for the local engineering team (2 engineers).
• International Coordination: Act as the primary technical interface with the Thailand-based team (responsible for complementary subsystems) to ensure seamless mechanical and system integration.
• Stakeholder Management: Collaborate closely with the System Engineer and Project Manager to align design progress with project milestones.
• BOM Management: Manage and maintain the System BOM (Bill of Materials), ensuring accuracy and traceability.
• Requirements Analysis & Flow-down: Analyze customer specifications and System Requirements to define mechanical constraints (thermal, structural). Translate these high-level requirements into actionable tasks for the engineering team.
• Compliance Management: Maintain the Requirements Compliance Matrix (VCRM), ensuring every design decision (materials, coatings, fasteners) aligns with the technical specs and MIL-STD-810 standards

2. Design & Development (SolidWorks):

• Rugged Packaging: Supervise the mechanical design of VPX 3U based systems, ensuring structural integrity and IP65 sealing (watertight/dust-tight) for harsh environments.
• Thermal Management: Lead the design of high-efficiency thermal solutions (conduction cooling) for high-power density electronics. This may include the use of heat pipes, heat spreaders, cold plates.etc.
• System Integration: Oversee the integration of the Backplane and the IO Panel (circular connectors), defining the interconnection strategy (cabling to payloads or rigid-flex PCB to backplane).

3. Verification & Prototyping:

• Supervise prototype assembly and integration.
• Define and oversee verification plans according to MIL-STD-810 / D0-160 standards (vibration, shock, temperature, etc.).

Knowledge/Skills/Competencies

• Education: Bachelor’s degree in Mechanical Engineering , Aerospace or related field.
• Experience: 5+ years of experience in mechanical design for electronics packaging, with proven experience leading technical teams or managing work packages.
• Software Proficiency: Expert knowledge of SolidWorks and SolidWorks Simulation (thermal & structural analysis). Jira or JAMA is recommended.
• Technical Skills:
  • Deep understanding of thermal management in sealed enclosures (conduction cooling).
  • Experience designing for IP65 environments.

• Languages: Fluent English is mandatory for daily communication with international teams.

Nice to have:

• Industry Background: Previous experience in the Defense or Aerospace sectors is a strong plus.
• Experience with VPX or similar modular architectures.
• Standards: Familiarity with military standards (MIL-STD-810, DO-160) and VITA specifications.
• Manufacturing: Knowledge of manufacturing processes (CNC machining) and surface treatments/finishes suitable.

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.